| Produsen: | Multicore |
|---|---|
| Kategori Produk: | Solder |
| Lembar data: | 397952 |
| Deskripsi: | HMP 366 3% .022DIA. 23AWG |
| Status RoHS: | Sesuai RoHS |
| Atribut | Nilai atribut |
|---|---|
| Produsen | Multicore |
| Kategori Produk | Solder |
| Bentuk | Spool, 8.8 oz (250g) |
| Jenis | Wire Solder |
| Seri | 366 |
| Berat badan | 0.551 lb (249.93 g) |
| Proses | Leaded |
| Diameter | 0.022" (0.56mm) |
| Jenis fluks | Rosin Activated (RA) |
| Kehidupan rak | - |
| Pengukur kawat | 23 AWG, 24 SWG |
| Komposisi | Pb93.5Sn5Ag1.5 (93.5/5/1.5) |
| Status bagian | Active |
| Titik lebur | 565 ~ 574°F (296 ~ 301°C) |
| Info pengiriman | - |
| Penyimpanan DIGI-Key | - |
| Shelf hidup mulai | - |
| Suhu penyimpanan/pendinginan | - |
| Harga refrence ($) | 1 pcs | 100 pcs | 500 pcs |
|---|---|---|---|
| $19.94 | $19.54 | $19.15 |